PC BOARD FABRICATION
We specialize in concept prototypes as well as small to large volume production runs. Large, low-cost production is also available through our offshore partners.
Our PC board manufacturing facility is located in the same facility as our layout and CAM team. This allows our customers to take advantage of a smooth, seamless flow of work from layout and design through manufacturing.
We specialize in prototype manufacturing and work closely with our customers to achieve their goals and specific needs with one-on-one customer service.
PCB MANUFACTURING CAPABILITIES
Generation Circuits has organized the tables below into three technology categories: Standard, Advanced, and Future.
To achieve the lower cost of your project; your design should stay within the scopes of the “Standard” category. We understand this isn’t always possible with today’s advanced features and requirements. Because of this, we offer two additional technological categories.
The next category is “Advanced”, which Generation Circuits builds in production each day. This is the major focus that Generation Circuits continues to invest in to help customers keep cost down as they move into more advanced production runs.
The “Future” category is technology our engineering team is currently working on. In most cases this requires extra focus, inspection, and engineering throughout the whole process.
Remember, we are here to help you every stage of the way. From Design to Production, to Assembly, we are your final destination for PC Board solutions.
| STANDARD | ADVANCED | FUTURE | |
| Panel Sizes | 18x16” & 18x24" | 18x16” & 18x24" | 18x16” & 18x24" |
| Layer Count | 2 to 12 | 14-22 | 22+ |
| LAMINATE MATERIAL | |||
| FR4 Tg 140 | Yes | Yes | Yes |
| FR4 Tg 170 | Yes | Yes | Yes |
| FR4 Tg 180 (RoHS) | Yes | Yes | Yes |
| Rogers High Frequency Laminates | Yes | Yes | Yes |
| Polyimide | Yes | Yes | Yes |
| FINISHED THICKNESS | |||
| Double Sided | 0.032” to 0.059” | 0.005" to 0.250" | >0.250" |
| Finished Thickness [Multilayer] | 0.018" to 0.220" | 0.220" to 0.250" | Greater than 0.250" |
| Minimum Core Thickness | 0.005" | 0.004" | 0.004" |
| Finished Thickness Tolerance [+/-] | 10% | 7-10% | 7-10% |
| Multiple Laminations | 1 | 2-3 | 4+ |
| Copper Foil Weights Internal |
3/4 oz. to 2.0 oz. | 1/4 oz. to 3.0 oz. | >5.0 oz. |
| Copper Foil Weights External |
3/4 oz. to 2.0 oz. | 3/4 oz. to 2.0 oz. | >3.0 oz. |
| STANDARD | ADVANCED | FUTURE | |
| LINES, SPACES, & PAD SIZE |
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| Internal Conductor Width | 0.005-0.006" | 0.004 - 0.0035” | Less than 0.0035" |
| Internal Conductor Spacing | 0.005-0.006" | 0.004 - 0.0035” | Less than 0.0035" |
| External Conductor Width | 0.005-0.006" | 0.004 - 0.0035” | Less than 0.0035" |
| External Conductor Spacing | 0.005-0.006" | 0.004 - 0.0035” | Less than 0.0035" |
| Int. Pad Size-Annular Ring each Side (Fin.-.001) | 0.006" | 0.005-0.004" | Less than 0.004" |
| Ext. Pad Size-Annular Ring each Side (Fin.-.002) | 0.006" | 0.005-0.004" | Less than 0.004" |
| SMT Pad Pitch - SMD | 0.018” - 0.016" | 0.014" | Less than 0.014" |
| Impedance | 10% | 7% | < 7% |
| Tin Lead Plating Thickness | Copper Coverage | 0.003” | < 0.003” |
| Nickel Plating Thickness | 100-150 Micro inches | 250 Micro inches | > 250 Micro inches |
| Gold Plating Thickness | 20-50 Micro inches | As Specified | As Specified |
| Minimum Drilled Hole Size | 0.0100” | 0.0079” | <0.004” |
| Hole Aspect Ratio | 10 to 1 | 12 to 1 | >12 to 1 |
| FINAL SURFACE FINISH |
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| HASL | Yes | Yes | Yes |
| Bare Copper | Yes | Yes | Yes |
| White Tin | Yes | Yes | Yes |
| Carbon Ink | Yes | ||
LEAD FREE SURFACE FINISHES - ROHS |
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| Electroless Nickel | Yes | Yes | Yes |
| Immersion Gold | Yes | Yes | Yes |
| Immersion Silver | Yes | Yes | Yes |
| OSP Preservative | Yes | Yes | Yes |
| Lead Free HASL | Yes | Yes | Yes |
| TOLERANCES |
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| Drilled hole to copper | 0.012” | 0.010” | Less than 0.010” |
| Plated Hole Tolerances [+/-] | 0.003" | 0.003" | Less than 0.003" |
| Non Plated Hole Tolerances [+/] | 0.001" | 0.001" | Less than 0.003" |
| Fabrication Tolerances [+/-] | 0.010” | 0.005” | Less than 0.005” |
VIA HOLE FINISH |
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| Blind / Buried Vias | No | Yes | Yes |
| Via Under PAD | No | Yes | Yes |
| Castellation/Edge Plating | No | Yes | Yes |
| Tented LPI | Coated With LPI | Coated/plugged | Coated/plugged |
| Silver Conductive Via Fill | No | Yes | Yes |
| Non-Conductive Via Fill | No | Yes | Yes |
| Copper Filled Via | No | Yes | Yes |
SOLDERMAS RESIST AND LEGEND |
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| Minimum Mask Clearance [LPI] | 0.004" | 0.003-0.002" | Less than 0.002" |
| Minimum Mask Clearance [LPI] | 0.001 | 0.001 | 0.001 |
| Soldermask Type | LPI | Dry Film | N/A |
| Soldermask Color | Green | Blue, Red, Black, White (LED), Orange, Yellow, Purple, Pink, Clear | N/A |
| Soldermask Web Minimum | 0.004" | 0.0035-0.003" | Less than 0.003" |
| Legend Feature Size | 0.008" Wide X 0.032" High | 0.0055" Wide X 0.022" High | LPI legend .003 x .020 |
| Legend Color | White | Black & Yellow | N/A |
STANDARD: Implies the most economical for manufacturing.
ADVANCED: May incur additional charges.
FUTURE: May incur additional charges.
Generation Circuits will ship the boards on the promised date unless extenuating circumstances prevent this. Customers will be informed of any changes to the schedule as soon as possible.
STANDARDS
- IPC-A-600
- IPC-A-6011
- IPC-A-6012 Class 2 & 3
- ITAR Certified
- UL File # E172491 (issued since August 22, 1996)
- Flammability Rating UL: 94 V-O
- UL 796
- IPC Class 2 & 3
- RoHS and lead Free Products and Compliance
ACCEPTED KNOWN DATA TYPES
- Gerber 274x (274D)
- Excellon2 Drill Data
- PentaLogix CAM *.BIN Files
- ODB++
- Altium Altium Designer, *.PCBDOC Files
- Altium Protel Designer Files, *.PCB Files
- Mentor GraphicsPADs PCB CAD Files, *.PCB Files
- CadSoft EagleCAD PCB CAD Files, *.CAD files
FR4 MATERIALS
| PRODUCT | DESCRIPTION | INDUSTRY APPROVALS |
| Isola 370HR ...product bulletin | 180 Tg RoHS Non-DICY filled Phenolic glass epoxy material | IPC-4101B /21, /24, /26, /98, /99, /101, /126 |
| FR4 Epoxy | 170 Tg FR4 Glass epoxy material | IPC-4101B /21, /23, /24, /26 |
| FR4 Epoxy | 130 Tg FR4 Glass epoxy material | IPC-4101B /21, /24 |
SPECIALIZED MATERIALS
| PRODUCT | DESCRIPTION |
| Arlon 85N Polyimide ...product bulletin | High performance polyimide/E-Glass Tg 250 deg. C. (UL 94 HB) |
| Arlon 35N Polyimide ...product bulletin | High performance polyimide/E-Glass Tg 250 deg. C. (UL 94 V1) |
| Arlon 55NT Aramid ...product bulletin | 170 Tg non-woven aramid epoxy material |
| Ormet™ ...products | Conductive connectivity fill |
| Rogers RO3000/RO3200 Series | High Frequency Laminates (PTFE/Ceramic) |
| Rogers RO4000 Series | High frequency circuit materials (Woven glass reinforced, ceramic filled thermoset) |
| Rogers Duroid™ 5800 Series | High frequency PTFE laminates |
| Rogers Duroid™ 6000 Series | High frequency PTFE/Ceramic laminates |
LEAD TIMES
| STANDARD (days) | ADVANCED (days) | |
| 2 Layer Prototypes | 4 to 5 | 1 to 4 |
| 4 Layer Prototypes | 5 to 10 | 2 to 6 |
| 6 to 8 Layer Prototypes | 5 to 10 | 2 to 6 |
| 2 Layer Small Production | 5 to 7 | 1 to 4 |
| 4 Layer Small Production | 7 to 10 | 2 to 6 |
| Medium Production (<1000) | Call for details | Call for details |
| Large Production (>1000) | Call for details | Call for details |
STANDARD: Implies the most economical for manufacturing.
ADVANCED: May incur additional charges. Contact us for further information.
Other factors may apply to shorten delivery time without incurring exceptional expedite charges.
Please contact us for precise delivery.
Generation Circuits will ship the boards on the promised date unless extenuating circumstances prevent this. Customers are informed of any changes to the schedule as soon as possible.
ADDITIONAL SERVICES
- 100% Net list bare board electrical testing
- Carbon paste
- Enclosure and face plate silk-screening
- Laser photo plotting services