PC BOARD FABRICATION
We specialize in concept prototypes as well as small to large volume production runs. Large, low-cost production is also available through our offshore partners.
Our PC board manufacturing facility is located in the same facility as our layout and CAM team. This allows our customers to take advantage of a smooth, seamless flow of work from layout and design through manufacturing.
We specialize in prototype manufacturing and work closely with our customers to achieve their goals and specific needs with one-on-one customer service.
CAPABILITIES
| STANDARD | ADVANCED | |
| Conductor width / Conductor spacing | 0.005" / 0.005" | 0.003" / 0.003" |
| Component pad pitch-SMD | 0.040" (1.02 mm) | 0.020" (0.5 mm) |
| Via hole diameter | 0.010" | 0.007" |
| Via pad size | 0.028" | 0.018" |
| Drill clearance on inner planes | 0.012" | 0.010" |
| Conductor to board edge | 0.020" | 0.010" |
| Un-pierced copper | 2.5" | N/A |
| Multi-layer count | 4 - 14 | 16 - 30 |
| Multi-layer minimum thickness | 0.015" | 0.015" |
| Dielectric core thickness | 0.004" | 0.003" |
| Dielectric prepreg (bonding) | 0.0025" | 0.0025" |
| Final finishes | Lead solder, lead-free solder, electrolytic hard gold, immersion gold (ENIG), ENEPIG (Ni/Pd/Au), wire bondable gold, immersion silver, immersion tin, OSP |
| LPI soldermask resist | Colors: Green, blue, red, black, white, orange, yellow, purple, pink |
| Dry film soldermask resist | Colors: Green |
| Silkscreen legend | Colors: White, black, yellow, red |
| Blind and buried via structures |
| Epoxy via fill, non-conductive and conductive |
| Ormet™ conductive materials |
| Controlled impedance/TDR testing |
| Plated edges/Castellated vias |
STANDARD: Implies the most economical for manufacturing.
ADVANCED: May incur additional charges. Contact us for further information.
Other factors may apply to shorten delivery time without incurring exceptional expedite charges.
Please contact us for precise delivery.
Generation Circuits will ship the boards on the promised date unless extenuating circumstances prevent this. Customers will be informed of any changes to the schedule as soon as possible.
STANDARDS
- IPC-A-600
- IPC-A-6011
- IPC-A-6012
- ITAR
- UL 94-VO
- UL 796
- IPC Class 2 & 3
ACCEPTED KNOWN DATA TYPES
- Gerber 274x (274D)
- Excellon2 Drill Data
- PentaLogix CAM *.BIN Files
- ODB++
- Altium Altium Designer, *.PCBDOC Files
- Altium Protel Designer Files, *.PCB Files
- Mentor GraphicsPADs PCB CAD Files, *.PCB Files
- CadSoft EagleCAD PCB CAD Files, *.CAD files
FR4 MATERIALS
| PRODUCT | DESCRIPTION | INDUSTRY APPROVALS |
| Isola 370HR ...product bulletin | 180 Tg RoHS Non-DICY filled Phenolic glass epoxy material | IPC-4101B /21, /24, /26, /98, /99, /101, /126 |
| FR4 Epoxy | 170 Tg FR4 Glass epoxy material | IPC-4101B /21, /23, /24, /26 |
| FR4 Epoxy | 130 Tg FR4 Glass epoxy material | IPC-4101B /21, /24 |
SPECIALIZED MATERIALS
| PRODUCT | DESCRIPTION |
| Arlon 85N Polyimide ...product bulletin | High performance polyimide/E-Glass Tg 250 deg. C. (UL 94 HB) |
| Arlon 35N Polyimide ...product bulletin | High performance polyimide/E-Glass Tg 250 deg. C. (UL 94 V1) |
| Arlon 55NT Aramid ...product bulletin | 170 Tg non-woven aramid epoxy material |
| Ormet™ ...products | Conductive connectivity fill |
| Rogers RO3000/RO3200 Series | High Frequency Laminates (PTFE/Ceramic) |
| Rogers RO4000 Series | High frequency circuit materials (Woven glass reinforced, ceramic filled thermoset) |
| Rogers Duroid™ 5800 Series | High frequency PTFE laminates |
| Rogers Duroid™ 6000 Series | High frequency PTFE/Ceramic laminates |
LEAD TIMES
| STANDARD (days) | ADVANCED (days) | |
| 2 Layer Prototypes | 4 to 5 | 1 to 4 |
| 4 Layer Prototypes | 5 to 10 | 2 to 6 |
| 6 to 8 Layer Prototypes | 5 to 10 | 2 to 6 |
| 2 Layer Small Production | 5 to 7 | 1 to 4 |
| 4 Layer Small Production | 7 to 10 | 2 to 6 |
| Medium Production (<1000) | Call for details | Call for details |
| Large Production (>1000) | Call for details | Call for details |
STANDARD: Implies the most economical for manufacturing.
ADVANCED: May incur additional charges. Contact us for further information.
Other factors may apply to shorten delivery time without incurring exceptional expedite charges.
Please contact us for precise delivery.
Generation Circuits will ship the boards on the promised date unless extenuating circumstances prevent this. Customers are informed of any changes to the schedule as soon as possible.
ADDITIONAL SERVICES
- 100% Net list bare board electrical testing
- Carbon paste
- Enclosure and face plate silk-screening
- Laser photo plotting services