Generation Circuits

(Formerly known as RB Design)

PC board fabrication
PC BOARD FABRICATION

We specialize in concept prototypes as well as small to large volume production runs. Large, low-cost production is also available through our offshore partners.

Our PC board manufacturing facility is located in the same facility as our layout and CAM team. This allows our customers to take advantage of a smooth, seamless flow of work from layout and design through manufacturing.

We specialize in prototype manufacturing and work closely with our customers to achieve their goals and specific needs with one-on-one customer service.

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PCB MANUFACTURING CAPABILITIES

Generation Circuits has organized the tables below into three technology categories: Standard, Advanced, and Future.

To achieve the lower cost of your project; your design should stay within the scopes of the “Standard” category. We understand this isn’t always possible with today’s advanced features and requirements. Because of this, we offer two additional technological categories.

The next category is “Advanced”, which Generation Circuits builds in production each day. This is the major focus that Generation Circuits continues to invest in to help customers keep cost down as they move into more advanced production runs.

The “Future” category is technology our engineering team is currently working on. In most cases this requires extra focus, inspection, and engineering throughout the whole process.

Remember, we are here to help you every stage of the way. From Design to Production, to Assembly, we are your final destination for PC Board solutions.

STANDARD ADVANCED FUTURE
Panel Sizes 18x16” & 18x24" 18x16” & 18x24" 18x16” & 18x24"
Layer Count 2 to 12 14-22 22+
LAMINATE MATERIAL
FR4 Tg 140 Yes Yes Yes
FR4 Tg 170 Yes Yes Yes
FR4 Tg 180 (RoHS) Yes Yes Yes
Rogers High Frequency Laminates Yes Yes Yes
Polyimide Yes Yes Yes
FINISHED THICKNESS
Double Sided 0.032” to 0.059” 0.005" to 0.250" >0.250"
Finished Thickness [Multilayer] 0.018" to 0.220" 0.220" to 0.250" Greater than 0.250"
Minimum Core Thickness 0.005" 0.004" 0.004"
Finished Thickness Tolerance [+/-] 10% 7-10% 7-10%
Multiple Laminations 1 2-3 4+
Copper Foil Weights
Internal
3/4 oz. to 2.0 oz. 1/4 oz. to 3.0 oz. >5.0 oz.
Copper Foil Weights
External
3/4 oz. to 2.0 oz. 3/4 oz. to 2.0 oz. >3.0 oz.
STANDARD ADVANCED FUTURE
LINES, SPACES, & PAD SIZE
Internal Conductor Width 0.005-0.006" 0.004 - 0.0035” Less than 0.0035"
Internal Conductor Spacing 0.005-0.006" 0.004 - 0.0035” Less than 0.0035"
External Conductor Width 0.005-0.006" 0.004 - 0.0035” Less than 0.0035"
External Conductor Spacing 0.005-0.006" 0.004 - 0.0035” Less than 0.0035"
Int. Pad Size-Annular Ring each Side (Fin.-.001) 0.006" 0.005-0.004" Less than 0.004"
Ext. Pad Size-Annular Ring each Side (Fin.-.002) 0.006" 0.005-0.004" Less than 0.004"
SMT Pad Pitch - SMD 0.018” - 0.016" 0.014" Less than 0.014"
Impedance 10% 7% < 7%
Tin Lead Plating Thickness Copper Coverage 0.003” < 0.003”
Nickel Plating Thickness 100-150 Micro inches 250 Micro inches > 250 Micro inches
Gold Plating Thickness 20-50 Micro inches As Specified As Specified
Minimum Drilled Hole Size 0.0100” 0.0079” <0.004”
Hole Aspect Ratio 10 to 1 12 to 1 >12 to 1
FINAL SURFACE FINISH
HASL Yes Yes Yes
Bare Copper Yes Yes Yes
White Tin Yes Yes Yes
Carbon Ink Yes    
LEAD FREE SURFACE FINISHES - ROHS
Electroless Nickel Yes Yes Yes
Immersion Gold Yes Yes Yes
Immersion Silver Yes Yes Yes
OSP Preservative Yes Yes Yes
Lead Free HASL Yes Yes Yes
TOLERANCES
Drilled hole to copper 0.012” 0.010” Less than 0.010”
Plated Hole Tolerances [+/-] 0.003" 0.003" Less than 0.003"
Non Plated Hole Tolerances [+/] 0.001" 0.001" Less than 0.003"
Fabrication Tolerances [+/-] 0.010” 0.005” Less than 0.005”
VIA HOLE FINISH
Blind / Buried Vias No Yes Yes
Via Under PAD No Yes Yes
Castellation/Edge Plating No Yes Yes
Tented LPI Coated With LPI Coated/plugged Coated/plugged
Silver Conductive Via Fill No Yes Yes
Non-Conductive Via Fill No Yes Yes
Copper Filled Via No Yes Yes
SOLDERMAS RESIST AND LEGEND
Minimum Mask Clearance [LPI] 0.004" 0.003-0.002" Less than 0.002"
Minimum Mask Clearance [LPI] 0.001 0.001 0.001
Soldermask Type LPI Dry Film N/A
Soldermask Color Green Blue, Red, Black, White (LED), Orange, Yellow, Purple, Pink, Clear N/A
Soldermask Web Minimum 0.004" 0.0035-0.003" Less than 0.003"
Legend Feature Size 0.008" Wide X 0.032" High 0.0055" Wide X 0.022" High LPI legend .003 x .020
Legend Color White Black & Yellow N/A

STANDARD: Implies the most economical for manufacturing.
ADVANCED: May incur additional charges.
FUTURE: May incur additional charges.

Generation Circuits will ship the boards on the promised date unless extenuating circumstances prevent this. Customers will be informed of any changes to the schedule as soon as possible.

STANDARDS
  • IPC-A-600
  • IPC-A-6011
  • IPC-A-6012 Class 2 & 3
  • ITAR Certified
  • UL File # E172491 (issued since August 22, 1996)
  • Flammability Rating UL: 94 V-O
  • UL 796
  • IPC Class 2 & 3
  • RoHS and lead Free Products and Compliance

ACCEPTED KNOWN DATA TYPES
  • Gerber 274x (274D)
  • Excellon2 Drill Data
  • PentaLogix CAM *.BIN Files
  • ODB++
  • Altium Altium Designer, *.PCBDOC Files
  • Altium Protel Designer Files, *.PCB Files
  • Mentor GraphicsPADs PCB CAD Files, *.PCB Files
  • CadSoft EagleCAD PCB CAD Files, *.CAD files

FR4 MATERIALS
PRODUCTDESCRIPTIONINDUSTRY APPROVALS
Isola 370HR
...product bulletin
180 Tg RoHS Non-DICY filled Phenolic glass epoxy materialIPC-4101B /21, /24, /26,
/98, /99, /101, /126
FR4 Epoxy170 Tg FR4 Glass epoxy material IPC-4101B /21, /23, /24, /26
FR4 Epoxy130 Tg FR4 Glass epoxy material IPC-4101B /21, /24

SPECIALIZED MATERIALS
PRODUCT DESCRIPTION
Arlon 85N Polyimide
...product bulletin
High performance polyimide/E-Glass Tg 250 deg. C. (UL 94 HB)
Arlon 35N Polyimide
...product bulletin
High performance polyimide/E-Glass Tg 250 deg. C. (UL 94 V1)
Arlon 55NT Aramid
...product bulletin
170 Tg non-woven aramid epoxy material
Ormet™ ...productsConductive connectivity fill
Rogers RO3000/RO3200 SeriesHigh Frequency Laminates (PTFE/Ceramic)
Rogers RO4000 SeriesHigh frequency circuit materials (Woven glass reinforced, ceramic filled thermoset)
Rogers Duroid™ 5800 SeriesHigh frequency PTFE laminates
Rogers Duroid™ 6000 SeriesHigh frequency PTFE/Ceramic laminates

Lead Free

LEAD TIMES
STANDARD (days)ADVANCED (days)
2 Layer Prototypes4 to 51 to 4
4 Layer Prototypes5 to 102 to 6
6 to 8 Layer Prototypes5 to 102 to 6
2 Layer Small Production5 to 71 to 4
4 Layer Small Production7 to 102 to 6
Medium Production (<1000)Call for detailsCall for details
Large Production (>1000)Call for detailsCall for details

 

STANDARD: Implies the most economical for manufacturing.
ADVANCED: May incur additional charges. Contact us for further information.
Other factors may apply to shorten delivery time without incurring exceptional expedite charges.
Please contact us for precise delivery.
Generation Circuits will ship the boards on the promised date unless extenuating circumstances prevent this. Customers are informed of any changes to the schedule as soon as possible.

Visit Quote center now

ADDITIONAL SERVICES
  • 100% Net list bare board electrical testing
  • Carbon paste
  • Enclosure and face plate silk-screening
  • Laser photo plotting services